P. K. Bernasko

Optimisation of Reflow Profile of Surface Mount Assembly Using Taguchi Design of Experiments

G. Takyi, P. K. Bernasko, 2015 .

Effect of solder joint integrity on the thermal performance of a TEC for a 980 nm pump laser module

P. K. Bernasko, G. Takyi, E. Amalu, 2011 .

Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach

P. K. Bernasko, S. Mallik, R. Bhatti, 2012 .

Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints

P. K. Bernasko, 2012 .

Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes

P. K. Bernasko, G. Takyi, 2015 .

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

P. K. Bernasko, G. Takyi, S. Mallik, 2015 .

Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering

P. K. Bernasko, Nduka Nnamdi (Ndy) Ekere, G. Takyi, 2009, 2009 11th Electronics Packaging Technology Conference.