C. Y. Liu

Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates

C. T. Lu, Y. Hsiao, H. Tseng, 2011 .

Electromigration-induced Kirkendall voids at the Cu∕Cu3Sn interface in flip-chip Cu∕Sn∕Cu joints

Y. C. Chuang, J. T. Chen, J. T. Chen, 2007 .

Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders

S. Wang, C. Y. Liu, S. J. Wang, 2003 .

High thermally stable Ni/Ag(Al) alloy contacts on p-GaN

C. Chou, H. Bor, Y. Chuang, 2007 .