J. Roullard

Characteristic Impedance of Integrated Interconnections: RF Experimental Extraction and Limit of Validity

Thierry Lacrevaz, Bernard Flechet, S. Capraro, 2012 .

Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic

C. Ferrandon, S. Capraro, A. Farcy, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Electrical characterization and impact on signal integrity of new basic interconnection elements inside 3D integrated circuits

C. Ferrandon, S. Capraro, A. Farcy, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology

A. Farcy, T. Lacrevaz, B. Flechet, 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).