Alexis Farcy

Characteristic Impedance of Integrated Interconnections: RF Experimental Extraction and Limit of Validity

Thierry Lacrevaz, Bernard Flechet, S. Capraro, 2012 .

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

Maxime Argoud, Pascal Vivet, Didier Lattard, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration

C. Ferrandon, S. Joblot, C. Laviron, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Intra-chip wireless interconnections based on high performances integrated antennas

Philippe Benech, C. Tinella, Olivier Richard, 2005 .

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits

Pascal Vivet, François de Crecy, Didier Lattard, 2016, IEEE Design & Test.

Recent progress in Silicon Photonics R&D and manufacturing on 300mm wafer platform

N. Vulliet, Charles Baudot, Frédéric Boeuf, 2015, 2015 Optical Fiber Communications Conference and Exhibition (OFC).

Stress management strategy to limit die curvature during silicon interposer integration

Olivier Thomas, Vincent Fiori, Pascal Chausse, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence

Pierre Montmitonnet, Stéphane Moreau, David Bouchu, 2015, Microelectron. Reliab..

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments

Olivier Thomas, Pierre Bar, Vincent Fiori, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).