Yixuan Fan

Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulation

Pengli Zhu, Gang Li, Rong Sun, 2023, 2023 24th International Conference on Electronic Packaging Technology (ICEPT).

A mechanical model for predicting the thermal expansion behavior of spherical particle reinforced epoxy composites

Pengli Zhu, Gang Li, Yuanyuan Yang, 2024, Polymer Composites.