Dave Harmon

A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride-oxide dielectrics

Fen Chen, Baozhen Li, Rolf-Peter Vollertsen, 2002, Microelectron. Reliab..

Design Development of Unitized Titanium Structure

Dave Harmon, Daniel Groneck, 2001 .

Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures

Fen Chen, Daniel C. Edelstein, B. Li, 2006, Microelectron. Reliab..

Design Development of Unitized Titanium Structure

Dave Harmon, Daniel Groneck, 2003 .

Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies

Fen Chen, Michael A. Shinosky, Dave Harmon, 2008, Microelectron. Reliab..