Sang Hwui Lee

Wafer-Level 3D Integration Technology Platforms for ICs and MEMS

Jian-Qiang Lu, J. J. McMahon, Ronald J. Gutmann, 2005 .

Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits

Anna W. Topol, Jian-Qiang Lu, Kuan-Neng Chen, 2006, 2006 International Electron Devices Meeting.

Low Temperature Copper-Nanorod Bonding for 3D Integration

Jian Yu, Gopal G. Pethuraja, Tansel Karabacak, 2006 .

Low Temperature Wafer Bonding by Copper Nanorod Array

Jian-Qiang Lu, Toh-Ming Lu, Tansel Karabacak, 2009 .

Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2006 .

Exploration of the Scaling Limits of 3D Integration

Jian-Qiang Lu, Robert E. Jones, Ronald J. Gutmann, 2006 .

An ultra-sensitive optical MEMS sensor for partial discharge detection

K. R. Farmer, Zhixiong Xiao, Sang Hwui Lee, 2005 .

Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review

Kuan-Neng Chen, James J.-Q. Lu, Sang Hwui Lee, 2011, Journal of Microelectromechanical Systems.