Jingyan Fu

Time-varying algorithm for swarm robotics

Ligang Hou, Jinhui Wang, Fangwen Fan, 2018, IEEE/CAA Journal of Automatica Sinica.

A TSV alignment design for multilayer 3D IC

Wei Zhao, Yang Yang, Ligang Hou, 2015, 2015 IEEE 11th International Conference on ASIC (ASICON).

The Design of High-Efficiency and Synergetic Attendance System

Ligang Hou, Jinhui Wang, Song Chen, 2015 .

Simplified empirical formula on TSV thermal analysis for 3D IC EDA

Ligang Hou, Bo Lu, Jinhui Wang, 2014, 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).

A novel thermal-aware structure of TSV cluster

Yang Yang, Wei Zhao, Ligang Hou, 2015, 2015 28th IEEE International System-on-Chip Conference (SOCC).

A thermal-aware distribution method of TSV in 3D IC

Wei Zhao, Ligang Hou, Na Gong, 2015, 2015 IEEE 11th International Conference on ASIC (ASICON).