Romit Kulkarni

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

Romit Kulkarni, Mahdi Soltani, Peter Wappler, 2020 .

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB

Romit Kulkarni, Tobias Groezinger, André Zimmermann, 2018, IEEE Access.

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

Romit Kulkarni, Tobias Groezinger, Mahdi Soltani, 2019, IEEE Access.

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

Romit Kulkarni, Tobias Groezinger, André Zimmermann, 2018, Instruments.

Experimental and computational study of array effects on LED thermal management on molded interconnect devices MID

Romit Kulkarni, Tobias Groezinger, André Zimmermann, 2018, 2018 13th International Congress Molded Interconnect Devices (MID).