Katti Guruprasad

3D technology roadmap and status

Bart Vandevelde, Eric Beyne, Paul Marchal, 2011, 2011 IEEE International Interconnect Technology Conference.

Verifying thermal/thermo-mechanical behavior of a 3D stack — challenges and solutions

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2010, Proceedings of 2010 International Symposium on VLSI Technology, System and Application.