Antonio La Manna

3D technology roadmap and status

Bart Vandevelde, Eric Beyne, Paul Marchal, 2011, 2011 IEEE International Interconnect Technology Conference.

ESD protection design in active-lite interposer for 2.5 and 3D systems-in-package

Eric Beyne, Mirko Scholz, Shih-Hung Chen, 2015, 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD).

An IC-centric biocompatible chip encapsulation fabrication process

Philippe Soussan, Chris Van Hoof, Dimitrios Velenis, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

Eric Beyne, Paul Marchal, Makoto Nagata, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fine Pitch Micro-Bump Interconnections for Advanced 3D Chip Stacking

Paresh Limaye, Eric Beyne, Philippe Soussan, 2011 .