David Huitink

Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters

Bakhtiyar Mohammad Nafis, Ange Iradukunda, David Huitink, 2018 .

Semi-empirical stress/energy-based acceleration of temperature cycling failure

Alan Lucero, David Huitink, 2015, 2015 IEEE International Reliability Physics Symposium.

Acceleration of chip - Package failures in temperature cycling

Alan Lucero, David Huitink, Kabir Enamul, 2014, 2014 IEEE International Reliability Physics Symposium.

A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages

Fang Luo, Ange-Christian Iradukunda, David Huitink, 2020, IEEE Journal of Emerging and Selected Topics in Power Electronics.

Nanolithography of metal catalysts by Dip Pen Nanolithography

Debjyoti Banerjee, David Huitink, Saion K. Sinha, 2007, SPIE Defense + Commercial Sensing.

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

David Huitink, Cody J. Marbut, Mahsa Montazeri, 2018 .

Tribochemistry as an Alternative Synthesis Pathway

Hong Liang, David Huitink, Hayden Carlton, 2020, Lubricants.

Coupled accelerated stress tests for comprehensive field reliability — Synergistic effects of moisture and temperature cycling

Nipun Sinha, Ankur Aggarwal, David Huitink, 2015, 2015 IEEE International Reliability Physics Symposium.

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink, 2017 .

Accelerated mechanical low cycle fatigue in isothermal solder interconnects

Bakhtiyar Mohammad Nafis, David Huitink, Cody J. Marbut, 2021 .

Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application

Fang Luo, Hongwu Peng, Balaji Narayanasamy, 2019, 2019 IEEE Energy Conversion Congress and Exposition (ECCE).

BAYESIAN OBJECT CLASSIFICATION OF GOLD NANOPARTICLES

Bani K. Mallick, Jianhua Z. Huang, Bledar A. Konomi, 2013, 1312.1560.

Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics

Fang Luo, Balaji Narayanasamy, Amol Deshpande, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).