W. Nakayama

发表

Electronic packaging and reliability education for the 21st century: the University of Maryland CALCE EPRC Program

W. Nakayama, Yogendra Joshi, Michael Pecht, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

A new approach to the design of complex heat transfer systems: notebook-size computer design

W. Nakayama, Masud Behnia, M. Nakanishi, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

A novel approach to the design of complex heat transfer systems: portable computer design-a case study

W. Nakayama, Masud Behnia, D. Soodphakdee, 2001 .

On the accommodation of coolant flow paths in high-density packaging

W. Nakayama, 1990 .

A novel approach to the design of complex heat transfer systems: heat spreader and portable computer design-case studies

W. Nakayama, D. Soodphakdee, M. Behnia, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

Heat transfer from micro-finned and flat surfaces to flow of Fluorinert coolant; boiling heat transfer

W. Nakayama, Masud Behnia, H. Mizunuma, 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

Heat-transfer engineering in systems integration: outlook for closer coupling of thermal and electrical designs of computers

W. Nakayama, W. Nakayama, 1995 .

Local Characteristics of Convective Heat Transfer From Simulated Microelectronic Chips to Impinging Submerged Round Water Jets

W. Nakayama, W. Nakayama, C. F. Ma, 1993 .

Heat transfer from micro-finned surfaces to flow of fluorinert coolant in reduced-size channels

W. Nakayama, Masud Behnia, M. Behnia, 1996 .

Numerical simulation of combined natural convection-conduction cooling of multiple protruding chips on a series of parallel substrates

W. Nakayama, Masud Behnia, 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

Manifold microchannel heat sinks: isothermal analysis

W. Nakayama, Masud Behnia, D. Copeland, 1996 .

Heat conduction in composites of thermally dissimilar materials - a methodology to economize numerical heat transfer analysis of electronic components

W. Nakayama, 2005, 2005 International Symposium on Electronics Materials and Packaging.

Fundamental research on heat transfer performances of solar focusing and tracking collector

W. Nakayama, Yasuo Mori, Kunio Hijikata, 1977 .

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

W. Nakayama, Masud Behnia, Yoshihiro Kondo, 1998 .

A data shifter-the vehicle for study of thermal-electrical interactions in integrated circuits

W. Nakayama, 1992, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems.

Single chamber compact thermosyphons with micro-fabricated components

W. Nakayama, Yogendra Joshi, S. S. Murthy, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

Secondary flows and enhanced heat transfer in rotating pipes and ducts

W. Nakayama, Y. Mori, 1984 .

CFD simulations of heat transfer from a heated module in an air stream: Comparison with experiments and a parametric study

W. Nakayama, Masud Behnia, J. Wang, 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).