C-K. Hu

发表

Electromigration and stress reliability in multilevel interconnect metallization

Paul S. Ho, M. A. Moske, C-K. Hu, 1993, Other Conferences.

Quantitative nanoscale metrology study of Cu/SiO2 interconnect technology using transmission x-ray microscopy

Ian McNulty, Ismail C. Noyan, Cornelia C. Retsch, 2000 .

Electromigration failure due to interfacial diffusion in fine Al alloy lines

Paul S. Ho, M. B. Small, Kenneth P. Rodbell, 1993 .

Electromigration in two-level bamboo grain structure Al(Cu)/W interconnections

C-K. Hu, C. Stanis, N. J. Mazzeo, 1993 .

Electromigration in Cu/W Structure

M. B. Small, C-K. Hu, M. Small, 1992 .

Effect of copper on the microstructure and electromigration lifetime of Ti–AlCu–Ti fine lines in the presence of tungsten diffusion barriers

Ronald G. Filippi, Kenneth P. Rodbell, Anthony G. Domenicucci, 1996 .

A high performance 0.13 /spl mu/m copper BEOL technology with low-k dielectric

Daniel C. Edelstein, Sampath Purushothaman, Alina Deutsch, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

Lithography and fabrication processes for sub‐100 nm scale complementary metal–oxide semiconductor

Yuan Taur, J. J. Bucchignano, Shalom J. Wind, 1995 .

Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

Robert Rosenberg, C-K. Hu, Sandra G. Malhotra, 2001 .

Atom motion of Cu and Co in Cu damascene lines with a CoWP cap

Robert Rosenberg, S. T. Chen, C-K. Hu, 2004 .

In situ study of void growth kinetics in electroplated Cu lines

C-K. Hu, Eric G. Liniger, L. Gignac, 2002 .

Electromigration Cu mass flow in Cu interconnections

Robert Rosenberg, Andrew H. Simon, S. T. Chen, 2006 .

Effect of liner thickness on electromigration lifetime

Andrew H. Simon, C-K. Hu, Eric G. Liniger, 2003 .

Sub‐μm, planarized, Nb‐AlOx‐Nb Josephson process for 125 mm wafers developed in partnership with Si technology

William J. Gallagher, K. G. Stawiasz, Mark B. Ketchen, 1991 .

Electromigration in two-level interconnect structures with Al alloy lines and W studs

P. S. Ho, M. B. Small, C-K. Hu, 1992 .

Electromigration in physical vapor deposited Cu lines

R. Carruthers, C-K. Hu, Lynne M. Gignac, 1998 .

Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnections

C-K. Hu, Chenming Hu, 1995 .

Bimodal electromigration mechanisms in dual-damascene Cu line/via on W

Robert Rosenberg, Anthony K. Stamper, C-K. Hu, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

Sub‐μm linewidth input coils for low Tc integrated thin‐film dc superconducting quantum interference devices

K. G. Stawiasz, Mark B. Ketchen, C-K. Hu, 1992 .

Electromigration Drift Velocity in Al‐Alloy and Cu‐Alloy Lines

C-K. Hu, C. Stanis, K. L. Lee, 1996 .

Effect of metal liner on electromigration in Cu Damascene lines

Andrew H. Simon, Christophe Detavernier, C-K. Hu, 2005 .

Electromigration in aluminum damascene lines

Terence Kane, Ronald G. Filippi, Kenneth P. Rodbell, 1999 .

Electromigration in two-level interconnects of Cu and Al alloys

C-K. Hu, Chao-Kun Hu, B. Luther, 1995 .

Reliability and Copper Interconnections with Low Dielectric Constant Materials

C-K. Hu, C. Hu, 1998 .

Microstructure, impurity and metal cap effects on Cu electromigration

Robert Rosenberg, Andrew H. Simon, C-K. Hu, 2014 .

Electromigration in 0.25 μm wide Cu line on W

R. Carruthers, C-K. Hu, R. Carruthers, 1997 .

Electromigration in On-Chip Single/Dual Damascene Cu Interconnections

Robert Rosenberg, C-K. Hu, Eric G. Liniger, 2002 .

Electromigration and Diffusion in Pure Cu And Cu(Sn) Alloys

C-K. Hu, Patricia G. Blauner, T. J. Watson, 1996 .

Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)

Stephan A. Cohen, Anita Madan, C-K. Hu, 2012 .

Backscattered Electron Imaging in the Scanning Electron Microscope: the Use of Either: (a) High Incident Energy or (b) an Array Detector

Conal E. Murray, Oliver C. Wells, C-K. Hu, 2008, Microscopy and Microanalysis.

Electromigration in Cu(Al) and Cu(Mn) damascene lines

Daniel C. Edelstein, Robert Rosenberg, Andrew H. Simon, 2012 .

Extendibility of Cu Damascene to 0.1 μm Wide Interconnections

Cyprian Emeka Uzoh, Kevin K. Chan, C-K. Hu, 1998 .