Andy Miller
发表
Eric Beyne,
Erik Jan Marinissen,
Mirko Scholz,
2015,
2015 International 3D Systems Integration Conference (3DIC).
Eric Beyne,
Manish Ranjan,
Andy Miller,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Anne Jourdain,
Andy Miller,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Anne Jourdain,
Fumihiro Inoue,
2018
.
Andy Miller,
2018
.
Mireille Maenhoudt,
Andy Miller,
Patrick Wong,
2009,
Lithography Asia.
Jeremy Louis Marzuola,
Andy Miller,
J. Marzuola,
2008,
J. Comb. Theory, Ser. A.
Eric Beyne,
Sandip Halder,
Andy Miller,
2013,
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
Eric Beyne,
Sandip Halder,
Andy Miller,
2014,
IEEE Transactions on Semiconductor Manufacturing.
Eric Beyne,
Erik Jan Marinissen,
Geert Van der Plas,
2019,
2019 International 3D Systems Integration Conference (3DIC).
Andy Miller,
Joseph D. Romano,
A. Rodriguez-Zermeno,
2012
.
Peter De Heyn,
Joris Van Campenhout,
Andy Miller,
2018,
2018 Optical Fiber Communications Conference and Exposition (OFC).
Andy Miller,
2013,
Discret. Math..
Eric Beyne,
Rama Puligadda,
Anne Jourdain,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
Dan T. Nguyen,
Arturo Chavez-Pirson,
Andy Miller,
2013,
Photonics West - Optoelectronic Materials and Devices.
Andy Miller,
2018
.
Eric Beyne,
Anne Jourdain,
Andy Miller,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Erik Jan Marinissen,
Andy Miller,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Warren W. Flack,
Piotr Czarnecki,
Andy Miller,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Teng Wang,
Eric Beyne,
Anne Jourdain,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
Francesco Testa,
Xin Yin,
Johan Bauwelinck,
2018,
OPTO.
Vincent Wiaux,
Geert Vandenberghe,
Mireille Maenhoudt,
2010,
International Conference on Micro- and Nano-Electronics.
Eric Beyne,
Dave Thomas,
Anne Jourdain,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
Eric Beyne,
Erik Jan Marinissen,
Anne Jourdain,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Eric Beyne,
Sandip Halder,
Mireille Maenhoudt,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
Andy Miller,
Matt Compton,
A. Miller,
1999,
J. Comb. Theory, Ser. A.
Anne Jourdain,
Sandip Halder,
Andy Miller,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
Eric Beyne,
Andy Miller,
Joeri De Vos,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
E. Beyne,
Andy Miller,
C. Gerets,
2012,
2012 4th Electronic System-Integration Technology Conference.
Xiao Sun,
Peter De Heyn,
Joris Van Campenhout,
2018,
2018 Optical Fiber Communications Conference and Exposition (OFC).
Eric Beyne,
Andy Miller,
Gerald Beyer,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Eric Beyne,
Anne Jourdain,
Andy Miller,
2018
.
Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs
Eric Beyne,
Andy Miller,
Gerald Beyer,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Eric Beyne,
Andy Miller,
John Slabbekoorn,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Andy Miller,
Nancy Heylen,
2016
.
Andy Miller,
Robert Hsieh,
John Slabbekoorn,
2015
.
Eric Beyne,
Anne Jourdain,
Andy Miller,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Andy Miller,
Herbert Struyf,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Eric Beyne,
Mikael Detalle,
Andy Miller,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Andy Miller,
Nancy Heylen,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Eric Beyne,
Anne Jourdain,
Andy Miller,
2016,
ECTC 2016.
Eric Beyne,
Mikael Detalle,
Andy Miller,
2016
.
Eric Beyne,
Sandip Halder,
Ingrid De Wolf,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.