M. F. Davis

Multi-layer fully organic-based system on package (SOP) technology for RF applications

Kyutae Lim, Rao Tummala, Joy Laskar, 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

Design rule development for electrical modeling of RF multilayer packaging inductors

Joy Laskar, Gary S. May, U. Jalan, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA

Kyutae Lim, Rao Tummala, Joy Laskar, 2003 .

Integrated RF function architectures in fully-organic SOP technology

Sudipto Chakraborty, Kyutae Lim, Rao Tummala, 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).