Tamba Tugbawa

发表

MULTI-LEVEL PATTERN EFFECTS IN COPPER CMP

Duane S. Boning, Tom Brown, Tae Park, 1999 .

Copper CMP and Process Control

Ping Li, Duane S. Boning, Fritz Redeker, 1999 .

Overview of Methods for Characterization of Pattern Dependencies in Copper CMP

Duane S. Boning, Tamba Tugbawa, Tae Park, 2000 .

Modeling of Reverse Tone Etchback Shallow Trench Isolation Chemical Mechanical Polishing

Duane S. Boning, Terence Gan, Brian Lee, 2001 .

Modeling of Pattern Dependencies in Multi-Step Copper Chemical Mechanical Polishing Processes

Duane Boning, Lawrence Camilletti, Tamba Tugbawa, 2001 .

Determination of the Planarization Distance for Copper CMP Process

Duane S. Boning, Matthew J. Banet, Tamba Tugbawa, 1999 .

PATTERN AND PROCESS DEPENDENCIES IN COPPER DAMASCENE CHEMICAL MECHANICAL POLISHING PROCESSES

Duane S. Boning, Tamba Tugbawa, Y. Gotkis, 1998 .

MODELING OF PATTERN DEPENDENCIES FOR MULTI-LEVEL COPPER CHEMICAL-MECHANICAL POLISHING PROCESSES

Duane S. Boning, Brian Lee, Tamba Tugbawa, 2001 .