Paul Alan McConnelee

发表

A new power module packaging technology for enhanced thermal performance

Mustansir H. Kheraluwala, B. Ozmat, Charles Steven Korman, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

A high performance polymer thin film Power electronics packaging technology

Paul Alan McConnelee, Ray Fillion, Eladio Delgado, 2002 .

High Density, High Performance Modular DC-DC Power Converter

Michael Joseph Schutten, Charles Steven Korman, Paul Alan McConnelee, 2002 .

Ultrahigh barrier coating deposition on polycarbonate substrates

Tae Won Kim, Marc Schaepkens, Christian Maria Anton Heller, 2004 .