D. Agonafer

Numerical simulation of convection in electronic equipment cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989

A. Ortega, D. Agonafer, 1989 .

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Exposition, D. Agonafer, 1997 .

Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

D. Agonafer, 1993 .

Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawai

Masumi Saka, Yung-Cheng Lee, D. Agonafer, 1999 .

Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

Exposition, D. Agonafer, 1996 .

Computer aided design in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

Robert E. Fulton, D. Agonafer, 1992 .

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

Robert E. Fulton, D. Agonafer, 1994 .

Simulation of PWB warpage during fabrication and due to reflow

D. Agonafer, S. Novotny, A.S. Halvi, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices

T. Dishongh, M.M. Hossain, Yongje Lee, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Fluxless optical fiber attachment for hermetic MOEMS applications

Jeongsik Sin, D. Agonafer, H. Beardsley, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Reliability of lead (Pb) free SAC solder interconnects with different PWB surface finishes under mechanical loading

P. Viswanadham, M.M. Hossain, D. Agonafer, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..