Chung-Ping Chien

The signal transmission characteristics of embedded microstrip transmission lines over a meshed ground plane in copper/polyimide multichip module

M. H. Tanielian, Chung-Ping Chien, A. F. Burnett, 1994 .

Reliability of passivated copper multichip module structures embedded in polyimide

Chung-Ping Chien, A. F. Burnett, J. M. Cech, 1993 .

High density interconnection using photosensitive polyimide and electroplated copper conductor lines

M. H. Tanielian, Chung-Ping Chien, J. M. Cech, 1989, Proceedings., 39th Electronic Components Conference.

Smart sensor multi-chip module with direct-chip-attached Micro-Electro-Mechanical System (MEMS) device

M. H. Tanielian, N. P. Kim, Chung-Ping Chien, 1999 .

Dependence of precursor chemistry and curing conditions on optical loss characteristics of polyimide waveguides

Kishore K. Chakravorty, Chung-Ping Chien, 1990, Optics & Photonics.

Fabrication and assembly of a digital transducer-to-bus interface module having a directly attached MEMS device

Namsoo P. Kim, M. H. Tanielian, Chung-Ping Chien, 2001 .