J. M. Cech

The signal transmission characteristics of embedded microstrip transmission lines over a meshed ground plane in copper/polyimide multichip module

M. H. Tanielian, Chung-Ping Chien, A. F. Burnett, 1994 .

Reliability of passivated copper multichip module structures embedded in polyimide

Chung-Ping Chien, A. F. Burnett, J. M. Cech, 1993 .

High density interconnection using photosensitive polyimide and electroplated copper conductor lines

M. H. Tanielian, Chung-Ping Chien, J. M. Cech, 1989, Proceedings., 39th Electronic Components Conference.

Pre-imidized photoimageable polyimide as a dielectric for high density multichip modules

J. M. Cech, Jay Martin Cech, Andrew Frank Burnett, 1992 .

Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films

J. M. Cech, A. Burnett, 1993 .