Shinn-Juh Lai

The database of Embedded Passives for RF-SiP design

Ra-Min Tain, Wei-Ting Chen, Chang-Sheng Chen, 2012 .

Design and implementation of mobile communications SiP modules with embedded components in multilayer organic hybrid substrate

Chang-Sheng Chen, Li-Chi Chang, Cheng-Hua Tsai, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Electrical Performance of Through-Silicon Vias (TSVs) for High-Frequency 3D IC Integration Applications

John H. Lau, Ming-Jer Kao, Shyh-Shyuan Sheu, 2012 .

A mobile WiMAX RF front-end module with integrated passive components and novel material

Wei-Ting Chen, Chang-Sheng Chen, Cheng-Hua Tsai, 2008, 2008 2nd Electronics System-Integration Technology Conference.