Zhuqing Zhang

发表

Double-Layer No-Flow Underfill Process for Flip-Chip Applications

Ching-Ping Wong, Zhuqing Zhang, Jicun Lu, 2003 .

Design, Process, and Reliability of Wafer Level Packaging

C. P. Wong, Zhuqing Zhang, 2007 .

Development of environmentally friendly nonanhydride no-flow underfills

Zhuqing Zhang, L. Fan, C. P. Wong, 2002 .