William R. Blood

STEADY STATE AND TRANSIENT THERMAL ANALYSIS OF CHIP SCALE PACKAGES

B. Chambers, Tien-Yu Tom Lee, William R. Blood, 1999 .

Thermal analysis of a chip scale package technology

B. Chambers, Tien-Yu Tom Lee, William R. Blood, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

MECL system design handbook

William R. Blood, Jon M. DeLaune, Edmund C. Tynan, 1980 .