Jungi Choi

Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study

Jeongho Cho, Vivek Chickermane, Brion L. Keller, 2013, 2013 IEEE International Test Conference (ITC).

Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process

Jeongho Cho, Jonghoon Park, Changhyun Lee, 2013, Microelectron. J..