Bjoern Boehme

Reliability Testing of FCCSP Packages for Automotive Applications

Karlheinz Bock, Karsten Meier, Laura Wambera, 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

Michael Thiele, Dirk Breuer, Himani Kamineni, 2017 .

Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

F. X. Che, Jong-Kai Lin, K. Y. Au, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements

Dirk Breuer, Lily Zhao, Michael Hecker, 2018 .

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept

Bernd Michel, Rainer Dudek, Bernhard Wunderle, 2007, Microelectron. Reliab..

Study of temperature dependent properties of organic substrate materials

Klaus-Jürgen Wolter, Bjoern Boehme, 2008, Microelectron. Reliab..

Package Qualification Envelope for 22FDX® Technology

Michael Thiele, Dirk Breuer, Bjoern Boehme, 2019 .

Chip package interaction with Cu Pillar interconnects - systematic study of key factors impacting the qualification

Dirk Breuer, Bjoern Boehme, Jens Paul, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Advanced chip package interaction qualification for critical stacks in combination with Cu pillar interconnect technology

Dirk Breuer, Bjoern Boehme, Jens Paul, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).