Liling Yan

Development of wafer level packaged scanning micromirrors

Chengkuo Lee, John H. Lau, Aibin Yu, 2008, SPIE MOEMS-MEMS.

Study of Ag-In solder as low temperature wafer bonding intermediate layer

Chengkuo Lee, John H. Lau, Chee Lip Gan, 2008, SPIE MOEMS-MEMS.

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

Chengkuo Lee, John H. Lau, Daquan Yu, 2009 .

Characterization of chemical inhomogeneity in plasma-sprayed hydroxyapatite coatings.

Yang Leng, Liling Yan, Y. Leng, 2003, Biomaterials.

A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu

Chengkuo Lee, Aibin Yu, Daquan Yu, 2009 .

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Chengkuo Lee, John H. Lau, Chee Lip Gan, 2009 .

A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint

Chengkuo Lee, Won Kyoung Choi, Aibin Yu, 2008, 2008 58th Electronic Components and Technology Conference.

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

Chengkuo Lee, John H. Lau, Won Kyoung Choi, 2009 .

Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging

Chengkuo Lee, John H. Lau, Aibin Yu, 2009 .