Cheng-Li Chuang

Reliability of HTS and HH/HT tests performed in chips and flex substrates assembled by a thermosonic flip-chip bonding process

Jong-Ning Aoh, Cheng-Li Chuang, Min-Yi Kang, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.

Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process

Jong-Ning Aoh, Cheng-Li Chuang, Rong-Fong Din, 2006, Microelectron. Reliab..

Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects

Jong-Ning Aoh, Cheng-Li Chuang, 2006 .

Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers

Jong-Ning Aoh, Cheng-Li Chuang, Shi-Jie Liao, 2008 .

Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding

Jong-Ning Aoh, Cheng-Li Chuang, 2004 .

Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive paste

Cheng-Li Chuang, Hui-Ta Chen, Hsun-Tien Li, 2010 .