D.F. Baldwin

High throughput flip chip processing and reliability analysis using no-flow underfills

R. Thorpe, D.F. Baldwin, L.P. McGovern, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Advanced encapsulation processing for low cost electronics assembly-a cost analysis

D.F. Baldwin, N.W. Pascarella, 1997, Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.

Chip scale polymer stud grid array packaging and reliability based on low cost flip chip processing

C.P. Wong, S. Sitaraman, D.F. Baldwin, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).