Zhenwei Hou

Wafer-applied underfill: flip-chip assembly and reliability

R.W. Johnson, Qing Wang, Fei Ding, 2004, IEEE Transactions on Electronics Packaging Manufacturing.

Recovery and Reuse of Waste PVC Coated Fabrics. Part 1: Experimental Procedures and Separation of Fabric Components

Zhenwei Hou, S. Adanur, R. Broughton, 1998 .