Carolyn F. H. Gondran

Location of interconnect defects using focused ion beam (FIB) induced voltage contrast and subsequent auger electron analysis of in-situ FIB cross sections in the physical electronics 200/300-mm SMART-tool

Kenton D. Childs, Carolyn F. H. Gondran, Dennis F. Paul, 2003, SPIE Advanced Lithography.

Contamination and degradation of 157-nm stepper optical components: field experience at International SEMATECH

Lisa R. Rich, Jeff Meute, Julian S. Cashmore, 2002, SPIE Advanced Lithography.

Novel technique for contamination analysis around the edge, the bevel, and the edge exclusion area of 200 and 300mm silicon wafers

Patrick S. Lysaght, Carolyn F. H. Gondran, Chris M. Sparks, 2003, SPIE Advanced Lithography.

Fin Sidewall Microroughness Measurement by AFM

Tsu-Jae King, Weize Xiong, Carolyn F. H. Gondran, 2004 .