Jinlin Wang

Performance test and analysis of the prototype of the electric motor-pump

Wenlu Wang, Hong Ji, Jinlin Wang, 2015 .

Design of Frequency Stability and Lock Stability Control System for Ring Laser Gyroscope

Chen Ming, Jinlin Wang, Guo Chuang, 2006, 2006 8th international Conference on Signal Processing.

Effects of Triboelectrostatic Charging Between Polymer Surfaces in Manufacturing and Test of Integrated Circuit Packages

Jinlin Wang, Rahul Panat, Edward Parks, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Measurements of nanofluid viscosity and its implications for thermal applications

Jinlin Wang, Patrick E. Phelan, David Song, 2006 .

3-D Numerical Simulation and Validation of Underfill Flow of Flip-Chips

Jinlin Wang, Sung-Won Moon, Zhihua Li, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Emerging challenges of underfill for flip chip application

Jinlin Wang, Tim Chen, Daoqiang Lu, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Vijay Subramanian, Jinlin Wang, Pramod Malatkar, 2019, Journal of Electronic Packaging.

Flow time measurements for underfills in flip-chip packaging

Jinlin Wang, 2005 .

Peel test metrology for solder joint reliability of FCBGA packages

Jinlin Wang, Woon Theng Saw, Chew Hong Tan, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

Jinlin Wang, Ravi Prasher, Suzana Prstic, 2003 .