Rachid Taibi

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, 2009, 2009 IEEE International Conference on 3D System Integration.

Low temperature direct bonding: An attractive technique for heterostructures build-up

F. Fournel, Léa Di Cioccio, Pierric Gueguen, 2012, Microelectron. Reliab..

200°C direct bonding copper interconnects : Electrical results and reliability

Stéphane Moreau, Léa Di Cioccio, Rachid Taibi, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Quartz structures for Coriolis Vibrating Gyroscopes

Rachid Taibi, Denis Janiaud, Raphael Levy, 2014, 2014 International Symposium on Inertial Sensors and Systems (ISISS).

Full characterization of Cu/Cu direct bonding for 3D integration

Pierric Gueguen, Rachid Taibi, Laurent-Luc Chapelon, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Pierric Gueguen, Rachid Taibi, Laurent Clavelier, 2011 .

Cu–SiO2 Hybrid Bonding

Pierric Gueguen, Rachid Taibi, Sebastien Mermoz, 2012 .