Laurent Vandroux

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, 2009, 2009 IEEE International Conference on 3D System Integration.

Treatments of Deposited SiOx Surfaces Enabling Low Temperature Direct Bonding

Laurent Vandroux, H. Moriceau, Ionut Radu, 2013 .

Insights on fundamental mechanisms impacting Ge metal oxide semiconductor capacitors with high-k/metal gate stacks

X. Garros, P. Batude, S. Deleonibus, 2007 .

Treatments of Deposited SiOx Surfaces Enabling Low Temperature Direct Bonding

Laurent Vandroux, H. Moriceau, Ionut Radu, 2013 .

Understanding of the thermal stability of the hafnium oxide/TiN stack via 2 “high k” and 2 metal deposition techniques

X. Garros, Laurent Vandroux, Pascal Besson, 2007 .

Low temperature direct bonding mechanisms of tetraethyl orthosilicate based silicon oxide films deposited by plasma enhanced chemical vapor deposition

Laurent Vandroux, C. Sabbione, L. Di Cioccio, 2012 .