Jérôme Dechamp

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, 2009, 2009 IEEE International Conference on 3D System Integration.

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement

Jérôme Dechamp, Séverine Cheramy, Amadine Jouve, 2015, 2015 International 3D Systems Integration Conference (3DIC).