François de Crecy

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, 2009, 2009 IEEE International Conference on 3D System Integration.

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits

Pascal Vivet, François de Crecy, Didier Lattard, 2016, IEEE Design & Test.

Using TSVs for thermal mitigation in 3D circuits: Wish and truth

Ricardo Reis, Pascal Vivet, François de Crecy, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects

Myriam Assous, David Bouchu, François de Crecy, 2007, Microelectron. Reliab..

Thermal correlation between measurements and FEM simulations in 3D ICs

François de Crecy, M. Haykel Ben Jamaa, Alexis Farcy, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).