Laurent-Luc Chapelon

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, 2009, 2009 IEEE International Conference on 3D System Integration.

200°C direct bonding copper interconnects : Electrical results and reliability

Stéphane Moreau, Léa Di Cioccio, Rachid Taibi, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

A method for connecting two integrated circuits and corresponding structure

Laurent-Luc Chapelon, Mohamed Bouchoucha, 2010 .

Challenges for Interconnect of Future CMOS Generations : Implementation of Emerging Processes and Alternative Architectures

Laurent-Luc Chapelon, Alexis Farcy, Vincent Arnal, 2005 .

3D integration demonstration of a wireless product with design partitioning

Pascal Ancey, Laurent-Luc Chapelon, F. Leverd, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Full characterization of Cu/Cu direct bonding for 3D integration

Pierric Gueguen, Rachid Taibi, Laurent-Luc Chapelon, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

New techniques to characterize properties of advanced dielectric barriers for sub-65nm technology node

Laurent-Luc Chapelon, S. Jullian, Alexis Farcy, 2006 .