Wei Koh

Memory Packaging Material and Assembly Trends

Wei Koh, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Memory device packaging - from leadframe packages to wafer level packages

Wei Koh, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).

Digital Memory Card Market and Technology

Wei Koh, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

System in package (SiP) technology applications

Wei Koh, 2005, 2005 6th International Conference on Electronic Packaging Technology.