Won-Sik Hong

PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development

Won-Sik Hong, Chulmin Oh, Chulmin Oh, 2009 .

Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints

Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, 2007 .

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

Jong-Woong Kim, Seung-Boo Jung, Jeong-Won Yoon, 2009 .

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

Seung-Boo Jung, Jeong-Won Yoon, Bo-In Noh, 2009 .