Chih-Yen Su

Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties

Wen-Fang Wu, Yao Hsu, Chih-Yen Su, 2011, Microelectron. Reliab..

Effect of parametric randomness on reliability analysis of wafer-level chip-scale packages

Wen-Fang Wu, Yao Hsu, Yao-Chung Chen, 2008, 2008 International Conference on Electronic Materials and Packaging.

An analytical procedure for estimating field lifetime and failure rate of electronic packages

Wen-Fang Wu, Yao Hsu, Chih-Yen Su, 2014 .