R. Gonella

发表

High performance k=2.5 ULK backend solution using an improved TFHM architecture, extendible to the 45nm technology node

V. Arnal, D. Reber, A. Farcy, 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

Demonstration of an extendable and industrial 300mm BEOL integration for the 65-nm technology node

D. Reber, A. Farcy, C. Cregut, 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

A new power sensitivity method of ranking branch outage contingencies for voltage collapse

R. Gonella, Alexander J. Flueck, J. R. Dondeti, 2002 .