Mohd. Amir Eleffendi

Thermal path integrity monitoring for IGBT power electronics modules

C. Mark Johnson, Mohd. Amir Eleffendi, 2014 .

Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement

Li Yang, C. Mark Johnson, Pearl A. Agyakwa, 2016, Microelectron. Reliab..

In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages

Mohd. Amir Eleffendi, C. M. Johnson, C. Mark Johnson, 2017, IEEE Transactions on Power Electronics.

A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module

Alberto Castellazzi, Jianfeng Li, Emre Gurpinar, 2018, IEEE Transactions on Power Electronics.

Application of Kalman Filter to Estimate Junction Temperature in IGBT Power Modules

C. Mark Johnson, Mohd. Amir Eleffendi, Mohd Amir Eleffendi, 2016, IEEE Transactions on Power Electronics.

Evaluation of on-state voltage VCE(ON) and threshold voltage Vth for real-time health monitoring of IGBT power modules

Mohd. Amir Eleffendi, Mohd Amir Eleffendi, C. M. Johnson, 2015, 2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe).