W. Shindo

Effective excursion detection by defect type grouping in in-line inspection and classification

Andrzej J. Strojwas, W. Shindo, E. H. Wang, 1999 .

Excursion detection and source isolation in defect inspection and classification [VLSI manufacture]

Andrzej J. Strojwas, Ram Akella, W. Shindo, 1997, 1997 2nd International Workshop on Statistical Metrology.

Effects of defect propagation/growth on in-line defect based yield prediction

Andrzej J. Strojwas, R. K. Nurani, W. Shindo, 1997, 1997 2nd International Workshop on Statistical Metrology.

Effective excursion detection and source isolation with defect inspection and classification

Andrzej J. Strojwas, Ram Akella, W. Shindo, 1997, 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop ASMC 97 Proceedings.

Effects of defect propagation/growth on in-line defect based yield prediction

Andrzej J. Strojwas, R. K. Nurani, W. Shindo, 1997, 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop ASMC 97 Proceedings.

Method of Minimizing Inspection Cost by Making Use of Programmed Defect Array

T. Hayano, S. Sakai, W. Shindo, 2006, 2006 IEEE International Symposium on Semiconductor Manufacturing.

In-line yield prediction methodologies using patterned wafer inspection information

Andrzej J. Strojwas, Wojciech Maly, R. K. Nurani, 1998 .

Low-energy large-mass ion bombardment process for low-temperature high-quality silicon epitaxy

Tadahiro Ohmi, W. Shindo, 1995, 1995 Symposium on VLSI Technology. Digest of Technical Papers.