Alexandru Prisacaru

Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes

Winco K. C. Yung, Xuejun Fan, Guoqi Zhang, 2020, Laser & Photonics Reviews.

Prognostics and health monitoring of electronic system: A review

Bongtae Han, Guo Qi Zhang, Przemyslaw Jakub Gromala, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Degradation Prediction of Electronic Packages using Machine Learning

Bongtae Han, Guo Qi Zhang, Przemyslaw Jakub Gromala, 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

Bongtae Han, Guo Qi Zhang, Przemyslaw Jakub Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

$In\ Situ$ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

Bongtae Han, Guo Qi Zhang, Andreas Theissler, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit

Bongtae Han, Dae-Suk Kim, Przemyslaw Jakub Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor

Yu-Hsiang Yang, Przemyslaw Jakub Gromala, Bongtae Han, 2020 .

Simulation Driven Design of Novel Integrated Circuits -- Physics of Failure Simulation of the Electronic Control Modules for Harsh Environment Application

Bongtae Han, Tobias Melz, Matthias Werner, 2016, Electronic Components and Technology Conference.

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor

Bongtae Han, Tobias Melz, Dirk Mayer, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter

Bongtae Han, Dae-Suk Kim, Przemyslaw Jakub Gromala, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Prognostics and health management of safety relevant electronics for autonomous driving

Alexandru Prisacaru, 2021 .

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach

Bongtae Han, Guo Qi Zhang, Przemyslaw Gromala, 2022, IEEE Transactions on Industrial Electronics.

Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison

Bernhard Wunderle, Peter Meszmer, Przemyslaw Jakub Gromala, 2021 .