Richard B. R. van Silfhout

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Willem D. van Driel, G. Q. Zhang, C. J. Liu, 2004, Microelectron. Reliab..

Virtual qualification of moisture induced failures of advanced packages [IC packages]

Willem D. van Driel, G. Q. Zhang, H. J. L. Bressers, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Prediction of Delamination Related IC & Packaging Reliability Problems

Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, 2005, Microelectron. Reliab..

Molecular simulation on the material/interfacial strength of the low-dielectric materials

Willem D. van Driel, G. Q. Zhang, Cadmus A. Yuan, 2007, Microelectron. Reliab..

Prediction of the epoxy moulding compound aging effect on package reliability

Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, 2010, Microelectron. Reliab..

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion

Willem D. van Driel, Olaf van der Sluis, R. A. B. Engelen, 2007, Microelectron. Reliab..

Prediction of crack growth in IC passivation layers

Willem D. van Driel, G. Q. Zhang, Leo J. Ernst, 2004, Microelectron. Reliab..

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions

Willem D. van Driel, G. Q. Zhang, Olaf van der Sluis, 2006, Microelectron. Reliab..