M. A. J. van Gils

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Willem D. van Driel, G. Q. Zhang, C. J. Liu, 2004, Microelectron. Reliab..

Virtual qualification of moisture induced failures of advanced packages [IC packages]

Willem D. van Driel, G. Q. Zhang, H. J. L. Bressers, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Advanced structural similarity rules for the BGA package family

A. Mavinkurve, Willem D. van Driel, G. Q. Zhang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Characterization and Modelling of Moisture Driven Interface Failures

Willem D. van Driel, G. Q. Zhang, Piet J. G. Schreurs, 2004, Microelectron. Reliab..

Analysis of Cu/low-k bond pad delamination by using a novel failure index

G. Q. Zhang, Olaf van der Sluis, J. H. J. Janssen, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Prediction of Delamination Related IC & Packaging Reliability Problems

Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, 2005, Microelectron. Reliab..

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion

Willem D. van Driel, Olaf van der Sluis, R. A. B. Engelen, 2007, Microelectron. Reliab..

Temperature stability of a piezoresistive MEMS resonator including self-heating

S. Nath, D. Wu, M. A. J. van Gils, 2008, Microelectron. Reliab..

Prediction of crack growth in IC passivation layers

Willem D. van Driel, G. Q. Zhang, Leo J. Ernst, 2004, Microelectron. Reliab..