K. X. Hu

A fracture mechanics analysis of the effect of backfill on the stability of cut and fill mine workings

John M Kemeny, K. X. Hu, J. Kemeny, 1994 .

The effective elastic moduli of microcracked composite materials

K. X. Hu, Yonggang Huang, Animesh Chandra, 1993 .

Stiffness Evaluation for Solids Containing Dilute Distributions of Inclusions and Microcracks

K. X. Hu, Yonggang Huang, Animesh Chandra, 1995 .

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

Karl W. Wyatt, K. X. Hu, K. Wyatt, 1996 .

Solder joint formation simulation and finite element analysis

Karl W. Wyatt, C.-P. Yeh, K. X. Hu, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Elastic moduli of a microcracked composite with spherical inclusions of cubic anisotropy

K. X. Hu, Yonggang Huang, Yonggang Huang, 1994 .

A Fracture Mechanics Approach to Modeling Strength Degradation in Ceramic Grinding Processes

Abhijit Chandra, K. X. Hu, A. Chandra, 1993 .

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

K. X. Hu, Yonggang Huang, Animesh Chandra, 1999 .