Patrick Tounsi

发表

Anaïs Cassou, Patrick Tounsi, Jean-Pierre Fradin, 2019, 2019 MIXDES - 26th International Conference "Mixed Design of Integrated Circuits and Systems".

Marc Legros, Patrick Tounsi, Benjamin Khong, 2007, Microelectron. Reliab..

Patrick Tounsi, Wasim Habra, Jean-Marie Dorkel, 2005 .

Patrick Tounsi, Jean-Pierre Fradin, Quang Chuc Nguyen, 2019, 2019 MIXDES - 26th International Conference "Mixed Design of Integrated Circuits and Systems".

Patrick Tounsi, Alexandre Boyer, Nabil El Belghiti Alaoui, 2018, J. Electron. Test..

Patrick Tounsi, Jean-Marie Dorkel, Toufik Azoui, 2010, 2010 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Patrick Tounsi, A. Deram, Jean-Baptiste Sauveplane, 2008, Microelectron. Reliab..

Patrick Tounsi, A. Bourennane, Marie Breil, 2012, Microelectron. Reliab..

Patrick Tounsi, Alexandre Boyer, Nabil El Belghiti Alaoui, 2019, Microelectronics Reliability.

Philippe Dupuy, Patrick Tounsi, Jean-Marie Dorkel, 2011, Microelectron. Reliab..

Régis Meuret, Patrick Tounsi, Michel Mermet-Guyennet, 2008, Microelectron. Reliab..

Patrick Tounsi, Jean-Marie Dorkel, Emmanuel Marcault, 2013, Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems - MIXDES 2013.

Patrick Tounsi, Jean-Pierre Fradin, Anas Cassou, 2018, 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Patrick Tounsi, J.-M. Dorkel, Jean-Baptiste Sauveplane, 2009, 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Patrick Tounsi, Pierre Temple-Boyer, Jean-Marie Dorkel, 2002, Microelectron. Reliab..

Patrick Tounsi, Alexandre Boyer, Nabil El Belghiti Alaoui, 2018, 2018 IEEE 27th North Atlantic Test Workshop (NATW).

Patrick Tounsi, Jean-Marie Dorkel, Jean-Michel Reynes, 2013, Microelectron. Reliab..

Patrick Tounsi, Alexandre Boyer, Nabil El Belghiti Alaoui, 2018, Microelectron. Reliab..

Patrick Tounsi, Jean-Marie Dilhac, Romain Monthéard, 2014, Journal of Electronic Materials.

Patrick Tounsi, Jean-Marie Dorkel, Jean-Michel Reynes, 2014, IEEE Transactions on Device and Materials Reliability.