T. D. Sullivan

Comparison of via/line package level vs. wafer level results

D. Tibel, T. D. Sullivan, 2001, 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167).

Influence of bedding plane shears on slope instability in sedimentary rocks : Proc 5th International Symposium on Landslides, Lausanne, 10–15 July 1988V1, P129–134. Publ Rotterdam: A A Balkema, 1988

T. D. Sullivan, R. Fell, J. P. MacGregor, 1989 .

Pressure dependency, strength-differential effect, and plastic volume expansion in metals

James Casey, T. D. Sullivan, 1985 .

Copper through silicon via (TSV) for 3D integration

T. D. Sullivan, J. Safran, R. Hannon, 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).

Comparison of isothermal, constant current and SWEAT wafer level EM testing methods

D. Tibel, T. D. Sullivan, T. Sullivan, 2001, 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167).