S. Ling

Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips

A. Dasgupta, S. Ganesan, D. Schatzel, 2007, Microelectron. Reliab..

The Biomolecular Interaction Network Database and related tools 2005 update

Ian M. Donaldson, Cheryl Wolting, Brigitte Tuekam, 2004, Nucleic Acids Res..

Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires

A. Dasgupta, S. Ganesan, K. K. Jinka, 2009, Microelectron. Reliab..